The power consumption of the AI generation of chips now requires use of direct liquid cooling to cold plates. The DLC closed loop in the white space, using usually presently MPG25% must be designed to supply enough coolant for the row and individual rack densities. However development of these chips is ongoing and power consumption will only increase. So how do we design a physical infrastructure to cope with these forthcoming designs for the next 4-6 years? The piping for the DLC is mission critical to the performance of the AI chip the design of the piping layout must account for redundancy to ensure complete security and peace-of-mind for the end clients.
With Mark Bulmer, Data Center Global Business Development Manager at Georg Fischer.
